Rambus Inc., an electronic chips and silicon IP provider, has agreed to acquire Hardent Inc., an electronic design firm.
The transaction will utilize Harden’s IP and services and their silicon design and error correction code expertise to help Rambus upscale their CXL Memory Interconnect Initiative. Hardent will bring 20 years of semiconductor experience and unique silicon design to the Rambus CXL Interconnect Initiative. The transaction is expected to close in the second quarter of 2022.
Luc Seraphin, president an CEO of Rambus, said, “The addition of the highly-skilled Hardent design team brings key resources that will accelerate our roadmap and expand our reach to address customer needs for next-generation data center solutions.”